ENZOTECH MST-73 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-73
heatsink is made by using a forged copper process which produces a dense material that is extremely efficient at heat extraction.
The MST-73 heatsink is far superior compared to traditional heat sinks currently found in the market.It provides the best thermal
conductivity available to dissipate heat from the MOSFET in your system.

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Dimensions (mm)
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79.5(L) x 14(W) x 29.6(H) |
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Material
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C1100 Forged Copper |
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Weight
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62g |
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Thermal Adhesive
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Fujipoly GR-d Thermal Tape |
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SUPPORTED MB
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ASUS
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P6T6 WS Revolution?�P6T WS Professional?�P6T Deluxe?�P6T Deluxe/OC Palm
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