ENZOTECH MST-66 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-66
heatsink is made by using a forged copper process which produces a dense material that is extremely efficient at heat extraction.
The MST-66 heatsink is far superior compared to traditional heat sinks currently found in the market. It provides the best
thermal conductivity available to dissipate heat from the MOSFET in your system.
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Dimensions (mm)
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72(L) x 13(W) x 29.6(H) |
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Material
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C1100 Forged Copper |
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Weight
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55g |
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Thermal Adhesive
|
Fujipoly GR-d Thermal Tape |
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SUPPORTED MB
|
|
GigaByte
|
EX58-UD5,EX58-UD4P,EX58-Extreme,GA-P35-DS3P,GA-P35-DS4,GA-P35-DQ6,GA-EP45-DS3P,GA-EP45-DS4,GA-EP45-DS5,GA-EP45-DQ6,GA-EP45-Extreme,GA-EP45T-Extreme |
