ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1-LE heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system. Compatible with all the Motherboards Pure forged copper Easy installation by using 3M™ 8815 Thermal Tape Multipack - Ten (10) piece set Dimensions (mm) 6.5(L) mm x6.5mm(W) x12mm(H) Material C1100 Forged Copper Finish Matt Black Weight 2g (Each) Thermal Adhesive 3M™ 8815 Thermal Tape (Datasheet)