AS-MSFIII-SN is formed in one piece. Using seamless welding technique, it allows the product to be smaller and provides
better thermal performance compared to other water cooled products in the market.
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Dimensions (mm)
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136.9(L) x 145.4(W) x42.2(H) |
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Weight
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290g |
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Material
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C1100 Copper |
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SUPPORTED MB
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ASUS
|
-Maximus III Formula |