AS-MSFIII-MOS is formed in one piece. Using seamless welding technic, it allows the product to be smaller and has better
thermal performance compared to other water cooled products in the market.
Dimensions (mm)
|
109.5(L) x108.8(W) x20.2(H) |
Weight
|
179g |
Material
|
C1100 Copper |
SUPPORTED MB
|
|
ASUS
|
-Maximus III Formula |
