Adhesive Tape and Grease

All standard heat sinks have options to include pre-applied thermal interface material upon request. The dimension of the thermal interface material will be 1mm smaller than the corresponding heat sink from each side. General guidelines for thermal interface material are available for reference.

For microprocessors, DC/DC converters and power modules, the phase change material is recommended. The material is rigid at room temperature and will get soften as the component reaches operating temperature. In additional, it has the ability to completely fill interface air gaps and voids presented in typical component package and heat sinks.

 

Phase Change Material

Type Standand
Size
color Operating
Temperature
(?)
Thermal
impedance
(? -in2/W)
Thermal
conductivity
W/mK
Thickness Manufacturer
T725 pink -60 to +125 0.03 @ 50psi 0.7 0.13(mm) [0.005"] Chomerics,T725
T710 light gray -60 to +125 0.1 @ 5psi 0.7 0.13(mm) [0.005"] Chomerics,T710
Hi Flow 105 dark gray -30 to +120 0.37 @ 25psi 0.9 0.14(mm) [0.006"] Bergquist,Hi Flow 105
PCS-TC-11 gray -40 to +125 0.04 @75um 3.8 0.13(mm) [0.005"] shin-ersu,PCS-TC-11


 

 


For plastic molded IC package, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.

Double Sided Tape

Type Standand
Size
color Operating
Temperature
(?)
Thermal
impedance
(? -in2/W)
Thermal
conductivity
W/mK
Thickness Manufacturer
T410 white -50 to +150 1.1 @ <1 psi   0.18(mm) [0.007"] Chomerics,PDF
T411 clear(silver) -50 to +150 1.0 @ <1 psi 0.5 0.28(mm) [0.011"] Chomerics,T411
T412 gray -30 to +125 0.25 @ <1 psi 1.4 0.23(mm) [0.009"] Chomerics,T412
8810 white   0.9 0.6 0.25(mm)
[0.01"]
3M,8810
8815 white   1.2 0.6 0.375(mm) [0.015"] 3M,8815
 


For plastic molded IC package, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.

Gap Filling Material

Type Standand
Size
color Operating
Temperature
(?)
Thermal
impedance
(? -in2/W)
Thermal
conductivity
W/mK
Thickness Manufacturer
Li-98 white -30 to +120 1.0 @ <1 psi 0.95 0.15(mm) [0.006"] T-global,Li-98
T-PCM905C yellow -25 to +125 0.048 @ 10psi 0.7 0.13(mm) [0.005"] Laird,T-PCM905C
T-PCM585 gray -40 to +125 0.02 @ <10 psi 3.8 0.13(mm) [0.005"] Laird,T-PCM585
 



For special impedance request, we propose the grease PSX-D. Grease is suitable for heat sinks and variety of heat dissipating components. During the air flow, it expels from the interface which reduces thermal impedance and the material becomes highly thermal transferable.

Grease

Type color Operating
Temperature
(?)
Thermal
impedance
(? -in2/W)
Thermal
conductivity
W/mK
Weight Manufacturer
PSX-D gray -40 to 200 0.009 3.4   Henkel
SC102 white -45 to 200 0.62 @ 40psi 0.8 1g Dow Corning,SC102
STC 640 gray paste -50 to +155 0.012 @ 50psi 1.8 1g PDF
AS5 Silver Peak: –50 to >180
Long-Term: –50 to 130
<0.0045
(0.001 inch layer)
>350,000
(0.001 inch layer)
3.5g Arctic,Arctic Silver® 5
CMQ-1G white Peak: –150 to >185
Long-Term: –150 to 130
<0.007
(0.001 inch layer)
>200,000
(0.001 inch layer)
1g Arctic,Céramique™ 2

Standard thermal pad and grease are shown in the table above. Additional materials to meet specific requirement are also available upon request.

Remark

Thermal pad or grease size is 1mm smaller than heat sink at every side .

For example :
Heat sink base 35x35mm(=A) , the thermal pad and thermal grease size will be at 33x33mm(=A-2).