EnzoTech Introduces Revolutionary Spring Loaded Uni-Holder® Snap-On Clips for BGA Heat Sinks


EnzoTech introduces Uni-Holder® clips to be used with its high performance, cold forged BGA heat sinks. Uni-Holder® is smartly designed to utilize the space between BGA package and its solder balls. It solves all the problems relating to heat sink attachment such as space, pressure and ease of assembly by using the principle of lever to provide optimum vertical pressure in a limited space


In addition it replaces unreliable thermal tape, Uni-Holder® allows engineers to use heat sinks with phase change TIM’s which have much better thermal performance than tapes.  TIM performance is pressure sensitive.  Uni-Holder® is engineered to provide constant pressure to obtain best performance from phase change TIM.  

Conventional Z-wire and spring loaded push pin attachment methods require mounting holes on the PCB that can make routing more difficult.  These also do not allow attachment of fan on top of heat sink.  There are other plastic clips available that can attach the heat sink by snapping it onto the chipset, but the clips usually require special tools to attach and remove and some do not provide sufficient pressure.

Technical Information

  Uni-H35051-23W-2.6 Uni-H35051-23W-2.6 + CLIP
Photo
200 LFM 2.636 oC/W 2.584 oC/W improved:2%
400 LFM 1.751 oC/W 1.700 oC/W improved:3%
600 LFM 1.400 oC/W 1.353 oC/W improved:3.5%
800 LFM 1.186 oC/W 1.140 oC/W improved:4%

Recent test data shows 2%-4% performance improvement for the same heat sink used with Uni-Holder.  Comparing the results, it shows Uni-Holder® can apply sufficient pressure on the TIM for better performance.

Major advantages of using Uni-Holder® heat sinks are:



Inquiry